Corrosion of complex electrical and electronic equipment is a problem to consider due to the costly and sometimes dangerous failures to which it results. Electronic components are a complex assembly of metallic and non-metallic materials, the corrosion processes in metallic components occur due to numerous factors, among which we can highlight: presence of humidity and corrosive agents (Cl-, H2S, SO2 and other pollutants contained in the air), the complexity and small size of the designed equipment that gives rise to galvanic corrosion processes, the transport of the equipment to industrial locations, the presence of low voltage impressed currents that accelerate dissolution of metals, contamination of surfaces during manufacture and assembly (causing a direct impact on the adhesion and operation of coatings, etc.).
The use of VpCI corrosion inhibitors provides safe and simple solutions for the protection of this equipment in the most aggressive environments.
Due to the aforementioned complexity of this type of equipment, there are numerous mechanisms, by which, the corrosion of electronic components can start. Based on eliminating these problems, we have resorted to the hermetic sealing of components in rooms, encapsulation, the use of metals that are increasingly resistant to corrosion, the use of desiccants, etc .; effective in reducing but not eliminating corrosion in electronic components.
Vapor phase corrosion inhibitors (VpCI) provide an effective solution to protect electronic components against corrosion processes; These compounds have a sufficient vapor pressure (10 -3 to 10 -5 mm Hg at 20ºC) to achieve their vaporization and consequently their subsequent condensation and adsorption on the metal surface forming a mono-molecular layer that allows passivation against aggressive agents. Not causing, the formed film does not cause any interference in the operation of electronic equipment or alteration of the conductivity and resistivity values of the metal.
Scheme that graphically shows the mechanism of action of the VCI molecules on the metal surface. The arrangement is detailed as a monomolecular layer, in which each of the VCI molecules that have condensed on the surface are arranged.